Federal opportunity from DIBBS • DEPT OF DEFENSE.DEFENSE LOGISTICS AGENCY.DLA LAND.DLA LAND WARREN MICHIGAN.DLA LAND WARREN. Place of performance: {}. Response deadline: May 18, 2026. Industry: NAICS 334412.
As DoD CMMC rollout expands, approximately 80%+ of DoD solicitations are expected to include cybersecurity/CMMC requirements, including many non-tech scopes.
Awarded-market signal for NAICS 334412 (last 12 months), benchmarked to sector 33.
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DIBBS RFQ listing for solicitation SPRDL1-26-Q-0057. Item or requirement: CIRCUIT CARD ASSEMBLY. Synopsis: TITLE (NOUN): Circuit Card Assembly NOTICE ID (SOLICITATION NO.): SPRDL1-26-Q-0057 PSC: 5998 NAICS: 334412 Bare Printed Circuit Board Manufacturing THIS IS A PRE-SOLICITATION NOTICE. DLA Land Warren plans to post the following requirement - Item: Circuit Card Assembly NSN: 5998-01-625-8832 Part Number: 12523323 Basic Quantity: 5Each. Option Quantity: Up to 5 Each. FOB Point: Destination. Packaging: MIL B. Type Award: Firm-Fixed-Price. Method of Acquisition: This Procurement is RESTRICTED to approved source DRS NETORK & IMAGING SYSTEMS, LLC CAGE 24290 . Only the approved source and/or its authorized distributors may submit offers which may be considered. To inquire about becoming an approved source on future buys , please contact the Competition Advocate's office. If interested in this acquisition effort, be sure to “FOLLOW” this notice and add your company information to the “Interested Vendors List.” The top drawing of the Technical Data Package (TDP) for this item is Source-Controlled and is only available to the source(s) and its authorized distributors. Please contact the Contract Specialist with any questions concerning this TDP. Please note: ONLY the Data Custodian, as identified in the United States/Canada Joint Certification Program (JCP) will be granted approval to download the Technical Data Package (TDP), once it is made available in Contract Review the DIBBS record and linked PDF for NSN details, packaging, clauses, and submission instructions.
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